化合物Compound 3444（镀锡中间体）

详细参数

化合物Compound 3444（镀锡中间体）

Compound 3444是Solderex TB硫酸盐型光亮酸锡的关键中间体。Solderex TB工艺是极光亮硫酸盐型的镀锡工艺，镀层的延展性、可焊性极佳，适用于挂镀，滚镀和高速镀工艺。对于铅锡PC抗蚀镀层，它是一种极好的无铅替代工艺。与其它酸锡工艺相比，Solderex TB适用的范围更宽，无论开缸还是补加，所用的光剂都很少，这使得工艺成本降低，镀液稳定。通过变换操作参数，此工艺适用于常规和高速操作，镀层极佳的可焊性已被ASTM B678-86试验所证明。
Compound 3444 is a key intermediate of Solderex TB sulfate based bright tin oxide. The Solderex TB process is an aurora bright sulfate type tin plating process, with excellent coating ductility and weldability, suitable for hanging plating, rolling plating, and high-speed plating processes. For lead-tin PC corrosion-resistant coatings, it is an excellent lead-free alternative process. Compared with other tin plating processes, Solderex TB has a wider range of applications, with very few light agents used for both cylinder opening and replenishment, which reduces process costs and stabilizes the plating solution. By changing the operating parameters, this process is suitable for both conventional and high-speed operations, and the excellent weldability of the coating has been proven by ASTM B678-86 tests.
 
产品参数：
物化性质：浅黄色至橙红色透明液体，PH值2.0~3.5，比重1-1.05g/cm3。
有效物质浓度：27%~30%
包装方式：25kg/桶、200kg/桶；亦可按照客户要求包装。
有效期：存放于阴凉干燥处，有效期2年。
 
用途：
电镀用中间体，硫酸型光亮镀锡低区走位剂。
此文章来自：金腾龙化工(www.smt-tl.com)